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特长1、提高了印刷线路板上的零部件贴装密度。
Improve mounting density of components on PC
board.
2、适应回流焊接。
Reflow solderable.
3、密封接点结构，提高了可靠性。
Contacts are completely
sealed,enhancing reliability.
|
项目Ltems
|
标准Standard
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|
额定电流(Rating)
|
50mA.12V DC
|
|
绝缘电阻（Insulation
resistance）
|
100m欧/min 100V
DC
|
|
接触电阻（Contact
resistance)
|
100m欧max
|
|
操作温度(Operating temperature range)
|
-30℃to +85℃
|
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寿命(Lifetime)
|
1000，000Cycles
|
|
操作力(Operating force)
|
90gf 180gf
250gf
|
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行程(Travel)
|
0.13±0.05mm
|
|
