Multicore? LF310solder paste is a halide-free, no clean, pin testable Pb-free solder paste, which has excellent humidity resistance and a broad process window, both for reflow and printing. LF318 solder paste offers a high tack force to resist component movement during high speed placement, long printer abandon times and excellent solderability over a wide range of reflow profiles in air and nitrogen and across a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP Copper.

   ? Outstanding humidity resistance – gives excellent coalescence even after 72 hours exposure to 27 ? C/80% RH, thus reducing process variation due to environmental factors

   ? Colourless residues for easy post-reflow inspection

   ? Soft non-stick pin testable residues allow easy in-circuit testing

   ? Suitable for fine pitch, high speed printing up to 150mm/s (6”/s)

   ? Extended open time & tack-life leading to low wastage.

   ? Halide free flux classification: ROL0 to ANSI/J-STD-004